Willow Grove, PA (PRWEB) September 14, 2005
Advanced Packaging Magazine and SEMI (Semiconductor Equipment and Materials International) sponsor the Advanced Packaging Award (APA). A distinguished panel of industry experts chooses the best technological advancements in 19 categories, including semiconductor assembly and test services.
K&S Quatrix is a revolutionary new interconnect technology, which offers greater electromechanical performance at lower cost-of-ownership. This new package test technology is based upon proprietary photolithographic technology developed exclusively by K&S.
Oded Lendner, K&S senior vice president, Package Test Business Unit, states, We are extremely pleased to have won the advanced packaging award with our new Quatrix technology. And we are also pleased to see that our first customers getting superior performance with higher yields, longer life and reduced maintenance in the final test area.
Quatrix is based on an advanced photolithographic manufacturing technology that produces no sliding parts and has higher mechanical precision with improved contacts, which offers high consistency along with excellent first pass yields.
Andrei Berar, Vice President Package Test, explains, Our first customers have fully tested Quatrix and they see first hand the benefits of our photolithographic process with its very precise and flexible geometries. Customers have come back to us showing repeatability on the order of 3 to 4 microns.
Additionally, Andrei states, Plus, they have shown longer contactor life with more than one million cycles, compared to traditional test sockets.
K&S plans to further expand its Quatrix product portfolio to all of the most demanding requirements such as testing in QFN, BGA and LGA devices. For more information on Quatrix technology, visit http://www.kns.com or send an email to Mark Sullivan, K&S Marketing Director, at email@example.com
Kulicke & Soffa (NASDAQ: KLIC) is the world’s leading supplier of semiconductor wire bonding assembly equipment. K&S is the only major supplier to the semiconductor assembly industry that provides customers with semiconductor wire bonding equipment along with the complementing packaging materials and test interconnect products that actually contact the surface of the customer’s semiconductor devices. The ability to control all of these assembly related products is unique to Kulicke & Soffa, and allows us to develop system solutions to the new technology challenges inherent in assembling and packaging next-generation semiconductor devices. Test interconnect products include a variety of wafer probe cards, ATE interface assemblies, and ATE boards for wafer testing, as well as test sockets for all types of packaged semiconductor devices. Kulicke & Soffa’s web site address is http://www.kns.com
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